Our expertise has enable us to ensure finest 

Thermal Grease

 by subjecting our products to stringent quality control measures during each stage of production and while dispatch. We sincerely welcome all relevant friends all over the world to come for visit and cooperation!

Thermal Grease is a high thermally conductive silicone material, and almost never curing temperature of -50 ℃ - 250 ℃, long-term use of the wealth of the state. With both excellent electrical insulation and excellent thermal conductivity, low oil from the degree (towards zero), high temperature resistance, water resistance, ozone resistance to weathering. Furthermore, our products are well-appreciated due to their purity, thermal and oxidative stability, hydrolytic stability and water tolerance etc. It also has high thermal resistance properties and does not melt or solidify at extreme temperatures. Tested on various parameters, these products offer very high drop point which is essential for thermal and structural stability. We are expert in manufacturing and supplying this range of Thermal Grease that finds versatile applications like mounting studs of transistors, diodes and silicone rectifies to provide effective heat seal and to improve conductivity at heat sink junctions. It can be widely applied over a variety of electronic products, the surfaces between the heating elements in electrical equipment ( power transistor , SCR, Electric heap , etc.) and cooling facilities (heat sink, heat, shell, etc.) , from heat transfer medium of the role and resistant of moisture , dust, corrosion , shock performance. They are also suitable for surface coating or as a whole potting for microwave communications, microwave transmission equipment, microwave power, and various power supply microwave devices.

Super User

Super User

Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions. 

Features:

1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister

2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet

3) Thickness: according to your requirements and usage 

JP-P400 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P400 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P400 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

 

JP-P300 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P300 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P300 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

 

JP-P230 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P230series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-230 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

 

JP-P130 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 

JP-P130 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 

So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly. 

JP-P130 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

 

JP-DL800B Made with high-purity thermal conducting materials, JP-DL800B exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-T180 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure. 
JP-T180 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity. 
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. 
Heat effect increased significantly. 
JP-T180 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.

JPNS200 are formulated with Synthetic fluids and highly conductive ceramic fillers. These finely engineered compounds provide low bleed and solve the problems of contamination and migration associated with silicone based products. 
They offer better stability for a longer life cycle with high thermal conductivity (2 W/m°K) and low thermal resistance (0.014 °C-in2/W).

Features:

1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister

2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet

3) Thickness: according to your requirements and usage 

Features:

1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister

2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet

3) Thickness: according to your requirements and usage