JunPus

Thermal Interface Material Exporter, Factory in Taiwan

JunPus International Co., Ltd. is a leading Manufacturer, Supplier and Exporter ofThermal Compound, Thermal Compounds, Thermal Compound Paste with a factory in Taiwan. We supply and export consistently high class products and continually improve upon the manufacturing processes and work environment through total employee involvement and strict adherence to fair business ethics. We have gained several patents in the field. Our sincerity and hard work has helped us to match our quality with international standards. If you are interested in any styles of our products, please feel free to contact us.
We are the leading manufacturer, supplier and exporter of which are engineered from the best quality raw material and are acknowledged for their sturdy construction and durable service life. During the manufacturing process, our expert teams checks the quality of the products thus we ensure the superior products to our clients. It is primarily used in the electronics and computer industries to assist a heat sink to draw heat away from a semiconductor component such as an integrated circuit or transistor. In electronics, it is often used to aid a component's thermal dissipation via a heat sink. We are best known for satisfying customers with the efficiency and long last lasting ability of our products. JunPus

Our secret of success has been our management's policy of adhering to business ethics in its dealing with customers. We assure you of on-time delivery of finest

thermal gel, thermal compound, thermal paste, heat paste, heat sink paste or heat sink compound

backed by prompted and careful after-sales service.

We are engaged in offering a wide range of thermal gel, thermal compound, thermal paste, heat paste, heat sink paste or heat sink compound that are manufactured using state-of-the-art technology and latest machinery. They are silicone fluids based on silicone, adding filler, thermal conductivity materials, and other polymer materials, with good thermal conductivity, electrical insulation, and are widely used in electronic components. Stringently formulated using optimum quality ingredients, these are formulated in accordance with set industry standards. The range will not harden or dry out or melt even after 1000 hours 200℃with good single component modified silicone system suitable for heat sink application. Due to use of cost efficient technology in our assembly unit, we can supply our complete range to the customers at market leading prices. Our expertise allows us to offer a comprehensive range of Thermal Compounds, which is developed in tandem with the international quality standards. Customer satisfaction is of prime importance at this field enterprise and so supreme quality raw materials are used for manufacturing the products. They insulate the hot surface, ensuring energy conservation, protection of operators and providing comfortable work environment. Owing to their features like impeccable quality, easy to use and longer life these are highly appreciated by our clients throughout the world. We devise our range with most modern state of the art facilities and our expertise also allows us to empower them with unmatchable uncompromising quality & outstanding services.

You are here:Home/Nano Diamond thermal compound/Nano Diamond Thermal Compound DL800B(Black)

Nano Diamond Thermal Compound DL800B(Black)

JP-DL800B Made with high-purity thermal conducting materials, JP-DL800B exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment.

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-DL800B Made with high-purity thermal conducting materials, JPD800B exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment.

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-DL800B Thermally conductive compounds are grease-like products which is formulated with Nano diamond powder and silicone fluids as base oil to provide superior thermal conductivity.

Good performance is obtained when use JP-DL800B for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.

Application:
Main ingredients:Nanodiamond, silicon
•Major applications:
o Heat sink interface for the high-power chips in power source electronics such as power supply
o Heat sink interface for High Bright LED High Bright LED
o Heat sink interface for CPU in various computers or high-power chips
o Heat sink interface for Graphics Processing Unit (GPU) in different display cards
•This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124
•Thermal Conductivity: 4.8 (W/m•K)

Product Features:
•Superior thermal conduction and low thermal resistivity.
•Wide range of applicable temperatures and stable thermal conductivity.
Better Rcontact : advantage II
•Easy to work with, non-caustic, anti-oxidation, not easily solidifying.

Coralloid shape
worse mobility and voids forming

Summary of Diamond Characters

Diamond(C)	Silver(Ag)	Alumina Nitride(AlN)
Insulator	Electrical conductive material Short circuit issue	Semiconductor Break-down after electric static discharge
Extremely good chemical and physical stability resistant to ambient & long term reliability	Catalyst material reliability issue	1.Slowly dissolve in mineral acids and strong alkalies 2.Slowly hydrolyze in water and oxidize in atmosphere reliability issue
Quasi-spherical shap1.smooth mobility 2.surface texture filling ability à less contact resistance	large flat geometry1.voids bridging2.strong aggregation after stirring	3-dim irregular shape Strong voids Worse contact resistance

Product name	JP-DL800B
Color Appearance	Black
Viscosity(mPa. s)	1,500,000
Specific Gravity(g/cm3)	2.2
Thermal Conductivity(w/m-K)	4.8
Thermal Resistance (℃*cm2/w)60Psi	0.095
Dielectric Constant	14.5 at 1MHz
Volatile matter(%)120℃@96hrs	0.24
Out Gasing(%),200℃@96hrs	0.01
Temperature Stability(℃)	-50 ~ 200
Shelf Life	3 years

August 30 2012

Additional Info

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